SMARTRAC is introducing SMART-LOOP PRELAM, designed for a range of eID applications that require moderate security.According to SMARTRAC, the product provides an extended read range with a very small antenna, minimal thickness (from 100 to 250 μm), high performance and unmatched mechanical durability and longevity. These features also translate into reduced complexity, resulting in easier handling of the pre-laminates during eID document manufacturing processes.SMARTRAC says: "SMART-LOOP PRELAM's advantages derive from SMARTRAC's patented wire-embedding and inductive coupling technologies. Wire embedding is used for the inlay's antenna, while inductive coupling supersedes the physical connection between chip and antenna, and incorporates two components: firstly, the chip and chip loop on a thin carrier bonded via flip-chip assembly; secondly, the wire-embedded antenna, which is connected to the chip loop via induction rather than by physical contact."It adds: "There is no damageable intermetallic connection between chip and antenna, making SMART-LOOP PRELAM one of the most robust and reliable PRELAM cards available on the market. To underline this, SMARTRAC is granting eID document manufacturers a 10-year warranty. Like any IC used in UHF pre-laminates, the integrated Impinj Monza 4D chip does not allow the storage of personal data. Instead, this data is obtained from external databases when the eID document is read. SMART-LOOP PRELAMs have an operating frequency of 860 – 960 MHz (UHF band), and feature a sheet format of up to 510 x 680mm. They comply with the ISO 18000-6C and EPC Class 1 Gen2 international standards. PC, PVC, PET and composites are available as carrier materials."With our latest innovation we are expending our product portfolio for eID document production," says Ralf Henn, senior vice president, Business Division Secure ID & Transactions at SMARTRAC. "Thanks to our comprehensive expertise we are able to provide our customers with a broad range of industry-leading products, underlining SMARTRAC's technology leadership based on our proprietary wire-embedding technology and inductive coupling expertise."

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