The organisers of the next-generation identity solutions event connect:ID 2018 – Science Media Partners and the International Biometrics + Identity Association (IBIA) have revealed the first speakers for the event. connect:ID 2018, which encompasses an in-depth conference and free exhibition, will be held from 30 April – 2 May 2018 at the Walter E. Washington Convention Center, Washington, DC. The event is expected to attract 1,300+ identity and security professionals from government and the private sector.In the conference, more than 75 experts will explore the latest thinking and innovations in human identity technologies and solutions across government, corporate, financial, and consumer markets.For the list of first speakers announced, see here.Speakers include Karen Hageman, Customs & Border Protection Officer, U.S. Department of Homeland Security, and Paul Hunter Chief, Biometrics Strategy, U.S. Citizenship and Immigration Services, Department of Homeland Security.Private sector speakers include Matthew Pruitt, Chief Federal Solutions Architect, NEC Corporation of America, and Greg Wolfond, CEO, SecureKey.To accommodate anticipated demand, the exhibition will also be expanded by a third, to more than 100 booths, allowing a wider breadth of leading organizations to showcase their cutting-edge solutions. The exhibition will, for the first time, include a Start-up Zone, where young businesses can gain vital exposure to high-level buyers and influencers from government and industry across the world.A newly-structured three-strand conference will demonstrate how government, industry, and consumers use identity solutions to accomplish their goals. The role of biometrics, digital ID, and next-generation secure credentials will be front and center, with vertical markets such as border management and fintech playing critical roles. The core themes to be addressed in 2018 are contained in the event's positioning paper – connect:ID 2018: Identity Accelerates (available at http://www.connectidexpo.com/creo_files/default/position_paper_2018.pdf)