SPS introduces multilayer paper solution for ePassport inlays

Smart Packaging Solutions, a world leader in dual interface eID documents and payment cards, is introducing a new product dedicated to ePassport manufacturers.SPS PFlex is an inlay made of multicoated synthetic paper. Thanks to its flexibility and durability qualities PFlex substrate constitutes an ideal inlay material for ePassport manufacturers. As it is made out of real cellulose-based with synthetic layers, PFlex brings an extreme stability in terms of resistance to temperature and humidity variations. SPS PFlex composition makes it a cost-effective solution for large volume manufacturing thanks to the fact direct costs are independent from the variations of raw materials such as oil.Thanks to SPS new lamination process, PFlex is adapted to all passport covers. In addition, its strength allows using thinner passport covers, thus bringing an extra cost reduction in the ePassport global manufacturing process. The combination of PFlex with a thin passport cover brings additional flexibility to the finished product. Moreover, PFlex can be easily combined with specific hinges to facilitate integration into any passport design. Of course, PFlex can be combined with SPS Customized Antenna Image (CAI) and Customized Module Image (CMI), which bring an easy-to-control additional security feature to ePassports.Domnique CharriÉ, Product Manager Identity, SPS declares: "With PFlex we are now able to propose an innovative, flexible material for ePassport, especially developed for eBooster technology. The fact that PFlex is essentially based on composite structure ensures a better environmental stability, associated with a lower cost." In related news, SPS will demonstrate VHBR (Very High Bit Rate) communication on its booth during Cartes Secure Connexions. Endorsed by leaders in the secure transactions industry, VHBR brings much faster communications between portable objects, such as ePassports, and readers.VHBR is particularly adapted to the high quantity of data required to read an ePassport, especially in anticipation of the LDS 2.0 (Logical Data Structure) standard currently under development at ICAO (International Civil Aviation Organization) that allows to store visas and travel stamps in the ePassport chip. Thanks to its VHBR technology, SPS will demonstrate a data transfer speed up to 6.8 Mbits per second on its booth at Cartes, while regular transfer speeds based on ISO 14443 standard are limited to 848 kbits per second.Note:SPS will be exhibiting at SDW 2016, 10-12 May, London, UK. SDW is a world-leading conference and exhibition event providing a global showcase for next-generation human identity solutions, focusing on intrinsic document security and on the new cutting-edge secure infrastructure now required to produce and use these advanced documents in live situations. http://www.sdw2016.com

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