Qualcomm CEO Steven Mollenkopf has confirmed at CES 2016 that the LeTV Le Max Pro will be the first phone to feature the Snapdragon 820 chipset, including its “Sense ID” ultrasonic fingerprint sensor.The ultrasonic-based solution uses sound waves to directly penetrate the outer layers of skin, detecting three-dimensional details and unique fingerprint characteristics, including fingerprint ridges and sweat pores that are not possible to detect with current capacitive touch-based fingerprint technologies.Giving the sensor an edge over rivals, the ultrasonic capabilities mean users can access the smartphone if their finger is wet, or even if it's swiping across the fingerprint sensor.The FIDO (Fast IDentity Online) Alliance-compliant sensor can also scan through a smartphone cover that is made of glass, aluminum, stainless steel, sapphire or plastics.”This is the first ultrasonic fingerprint sensor,” Mollenkopf said at the event.The Snapdragon Sense ID platform incorporates algorithms managed by the Qualcomm SecureMSM foundation, the Qualcomm Biometric Integrated Circuit and custom sensor technology. And it is integrated into the Qualcomm Haven authentication framework, which supports secure biometric authentication for a variety of online and off-line formats.The firm noted in a statement that Snapdragon Sense ID fingerprint technology is more difficult to spoof in part because the ultrasonic scan results in a highly detailed 3D map of the finger, capturing even fingerprint ridges and sweat pores, a level of detail that capacitive sensors simply can't. (Capacitive sensors can be easily spoofed; e.g., simulating a lifted fingerprint print.)The Le Max Pro will also be the first mobile device with the new liveness detection capability of Snapdragon Sense ID fingerprint technology.The Le Max Pro has the ultrasonic fingerprint sensor on its mirrored back, and the sensor has been placed under 400 micrometers of metal.Qualcomm are a platinum sponsor and an exhibitor at connect:ID 2016, 14-16 March, Washington DC. connect:ID is an international conference and exhibition that focuses on all aspects of identity technologies and the opportunities for their management in both the physical and digital worlds. http://www.connectidexpo.com